Thick Film Microcircuits Ltd 

Welcome to the TFM Web-site

 Contents Company Background

Thick Film Technology

Resistor Networks

Hybrid Circuits

Printed Circuit Boards

Product Development

Quality

Location, Maps

Contact Us
 
 
 



Company Background

Thick Film Microcircuits was established in 1977.

Throughout its life TFM has been dedicated to the design, development and manufacture of quality, custom thick film and related technology products. By combining some of the most experienced people in the industry with efficient design and production methods, the company has provided a wide range of highly regarded cost effective solutions to the professional electronics industry.

'Professionals need a professional service' is a policy that has allowed Thick Film Microcircuits to maintain a long term relationship with some of the world's largest and smallest companies.
 
 

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  Thick film Technology Thick film is a process whereby specially formulated pastes are screen printed and fired onto a ceramic substrate to produce conductive interconnects and resistive elements. Complex multilayer circuits can be created by the introduction of dielectric layers.

The resistors on the circuit can be laser adjusted to exact value either passively, or actively whilst the circuit is in operation.

High thermal conductivity properties of ceramic make it ideal for power dissipation over a small area.

The properties of Alumina ceramic make it suitable for interfacing with aluminium heat sinks to enhance a circuit's power handling capability.

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  Resistor Networks The simplest and most popular thick film circuit is the common chip resistor.

A custom Resistor Network offers many advantages over using several discrete devices.

These include:

Temperature Tracking to 10ppm / °C

Precise resistor values to a tolerance of ±0.1%

Value matching to ±0.1%

High thermal management

Can be designed to meet specific power and voltage requirements.

SM, SIL, DIL construction options implies savings in board real-estate.

Substantially reduced component count implies reduction board assembly costs

Fewer solder joints improve reliability.


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Hybrid Circuits

The principal of a thick film hybrid is similar to that of a resistor network however with the addition of active and passive surface mount components to form a complete functional module. These modules can either be SM, SIL or DIL.
  Benefits of hybrids include:
  High packing density

Low mass

High power handling

Resistors can be actively trimmed to a fixed circuit performance eliminating the need for Select On Test resistors, or potentiometers.

A cost-effective, fully tested module can be handled and administered as a single component.


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  Printed Circuit Boards Design: Often a customer requires the removal of several components from a printed circuit board to be replaced with a single hybrid module.

Thick Film Microcircuits Ltd can undertake the re-design of the PCB and of the resulting hybrid to produce a new, reduced component-count printed circuit board.

  

Assembly:

Thick Film Microcircuits offers a competitive component placement rate to rival some of the best in the industry. Components can either be sourced by TFM, or free-issued by the customer.
 


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 Product Development The experienced design team at TFM can quickly and efficiently develop customer ideas or assist in finding solutions to problems such as packing density, and/or high power dissipation.

Technologies such as thick film on steel can be supplied for specialist applications.

Product Delivery Depending on complexity, prototype batches are normally supplied within 2-4 weeks of customer approval of circuit layout.

Production run can commence immediately after prototype validation.

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Quality

                

Thick Film Microcircuits has a fully documented quality system which is accredited by SGS to the ISO 9001 quality system.

View Quality Certificate
 
 

The company emphasis and primary objective throughout all development and manufacturing stages is one of quality and service to the customer.

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Location

     We are conveniently situated:
 

       View Maps - How to find us.
 
 

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Contacts

Address: Thick Film Microcircuits Ltd
Ferry Lane Industrial Estate
Forest Road
London
E17 6JD
UK
  Telephone: +44 20 85317226

Facsimile:   +44 20 85275521
 

   info@thickfilm.co.uk
 
 
 
 

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